IEC 60749-15 Ed. 1.0 b:2003

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Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Product Details

Edition:

1.0

Published:

02/07/2003

Number of Pages:

11

File Size:

1 file , 230 KB