BS CWA 13882:2000

X.500 profile ADY41. Directory user agent (DUA) authentication as directory access protocol (DAP) initiator
standard by BSI Group, 04/15/2000

BS CECC 00114-3:1993

Rule of procedure 14. Quality assessment procedures. Capability approval of an electronic component manufacturing activity
standard by BSI Group, 05/15/1993

  • by admin
  • Comments Off on BS CECC 00114-3:1993
  • BS

BS CECC 32200:1989

Harmonized system of quality assessment for electronic components. Sectional specification: fixed chip capacitors with metallized electrodes and polyethylene-terephthalate dielectric for direct current
standard by BSI Group, 02/28/1989

BS CWA 13937-8:2003

J/eXtensions for financial service (J/XFS) for the Java platform. Sensors and indicators unit device class interface. Programmer's reference
standard by BSI Group, 04/01/2003

BS BIP 2072:2005

Quality of care in residential homes for the elderly
Handbook / Manual / Guide by BSI Group, 06/01/2005

BS CWA 14050-40:2007

Extensions for financial services (XFS) interface specification. Release 3.03. XFS MIB device specific definitions. Card embossing unit device class MIB 1.1 V5
standard by BSI Group, 07/01/2007

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  • BS

BS BIP 0093:2007

ITIL version 3. Service operation
Handbook / Manual / Guide by BSI Group, 09/03/2007

BS CECC 00111-8:1994

Rule of procedure 11. Specifications. Regulations for Technology Approval Schedules (TAS)
standard by BSI Group, 11/15/1994

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BS A 317:1997

Nuts, hexagonal, plain, normal height, normal across flats, with MJ threads, classifications. 600 MPa (at ambient temperature)/120 degreesC, 600 MPa (at ambient temperature)/235 degreesC, 900 MPa (at ambient temperature)/425 degreesC, 1100 MPa (at ambient temperature)/235 degreesC, 1100 MPa (at ambi
standard by BSI Group, 11/15/1997