Materials for printed boards and other interconnecting structures – Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) – Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
standard by International Electrotechnical Commission, 05/26/2009
Materials for printed boards and other interconnecting structures – Part 2-43: Reinforced base materials clad and unclad – Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
standard by International Electrotechnical Commission, 05/12/2016
Overhead lines – Requirements for greases for aluminium, aluminium alloy and steel bare conductors
standard by International Electrotechnical Commission, 10/12/2011
Standard for automatic test markup language (ATML) test adapter description
standard by International Electrotechnical Commission, 04/08/2016
Nuclear instrumentation – Microprocessor based nuclear radiation measuring devices
standard by International Electrotechnical Commission, 08/05/1994
Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 3-2: Examination and measurements – Polarization dependent loss in a single-mode fibre optic device
standard by International Electrotechnical Commission, 01/12/2009
Coaxial communication cables – Part 8-6: Detail specification for 75-047 type semi-flexible cables with solid polytetrafluoroethylene (PTFE) insulation
standard by International Electrotechnical Commission, 09/18/2012
Converter transformers – Part 3: Application guide
standard by International Electrotechnical Commission, 02/05/2015
Optical amplifiers – Part 2: Digital applications – Performance specification template
standard by International Electrotechnical Commission, 04/11/2007
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-3: General test methods for materials and assemblies – Soldering paste for printed board assemblies
standard by International Electrotechnical Commission, 01/08/2015
