IEC 62243 Ed. 2.0 en:2012
Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)
standard by International Electrotechnical Commission, 06/21/2012
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- IEC
Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)
standard by International Electrotechnical Commission, 06/21/2012
Multicore and symmetrical pair/quad cables for digital communications to be used in harsh environments – Part 1: Generic specification
standard by International Electrotechnical Commission, 02/17/2004
Photovoltaic (PV) module safety qualification – Part 2: Requirements for testing
standard by International Electrotechnical Commission, 08/18/2016
Energy management system application program interface (EMS-API) – Part 301: Common Information Model (CIM) base
standard by International Electrotechnical Commission, 11/30/2003
Industrial communication networks – Profiles – Part 3-3: Functional safety fieldbuses – Additional specifications for CPF 3
standard by International Electrotechnical Commission, 07/12/2016
Fibre optic active components and devices – Performance standards – Part 4: 1300 nm fibre optic transceivers for Gigabit Ethernet application
standard by International Electrotechnical Commission, 01/27/2003
Secondary batteries for the propulsion of electric road vehicles – Part 1: Test parameters
standard by International Electrotechnical Commission, 09/25/2006
Digital audio – Interface for non-linear PCM encoded audio bitstreams applying IEC 60958 – Part 3: Non-linear PCM bitstreams according to the AC-3 and enhanced AC-3 formats
standard by International Electrotechnical Commission, 07/28/2017
Electronic projection – Measurement and documentation of key performance criteria – Part 2: Variable resolution projectors
standard by International Electrotechnical Commission, 09/17/2001
Fibre optic connector optical interfaces – Part 3-5: Optical interface – 2,5 mm and 1,25 mm diameter cylindrical PC composite ferrule using Cu-Ni-alloy as fibre surrounding material, single mode fibre
standard by International Electrotechnical Commission, 11/27/2006