IEC 61753-111-8 Ed. 1.0 b:2009

Fibre optic interconnecting devices and passive components performance standard – Part 111-8: Sealed closures for category G – Ground
standard by International Electrotechnical Commission, 11/10/2009

IEC 62351-3 Ed. 1.0 b:2014

Power systems management and associated information exchange – Data and communications security – Part 3: Communication network and system security – Profiles including TCP/IP
standard by International Electrotechnical Commission, 10/28/2014

IEC 62047-16 Ed. 1.0 b:2015

Semiconductor devices – Micro-electromechanical devices – Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
standard by International Electrotechnical Commission, 03/05/2015

IEC 61834-2 Ed. 1.0 b:1998

Recording – Helical-scan digital video cassette recording system using 6,35 mm magnetic tape for consumer use (525-60, 625-50, 1125-60 and 1250-50 systems) – Part 2: SD format for 525-60 and 625-50 systems
standard by International Electrotechnical Commission, 08/25/1998

IEC 61784-1 Ed. 2.0 en:2007

Industrial communication networks – Profiles – Part 1: Fieldbus profiles
standard by International Electrotechnical Commission, 12/14/2007

IEC 61753-111-7 Ed. 1.0 b:2009

Fibre optic interconnecting devices and passive components performance standard – Part 111-7: Sealed closures for category A – Aerial
standard by International Electrotechnical Commission, 11/10/2009

IEC 62227 Amd.1 Ed. 1.0 b:2012

Amendment 1 – Multimedia home server systems – Digital rights permission code
Amendment by International Electrotechnical Commission, 11/29/2012

IEC 61988-5 Ed. 1.0 b:2009

Plasma display panels – Part 5: Generic specification
standard by International Electrotechnical Commission, 11/25/2009

IEC 61909 Ed. 1.0 b:2000

Audio recording – Minidisc system
standard by International Electrotechnical Commission, 06/16/2000

IEC 61837-2 Ed. 2.1 b:2014

Surface mounted piezoelectric devices for frequency control and selection – Standard outlines and terminal lead connections – Part2: Ceramic enclosures CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 03/14/2014