IEC 60050-431 Amd.1 Ed. 1.0 b:2021

Amendment 1 – International Electrotechnical Vocabulary (IEV) – Part 431: Transductors
Amendment by International Electrotechnical Commission, 04/06/2021

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IEC 60050-845 Ed. 2.0 b:2020

International Electrotechnical Vocabulary (IEV) – Part 845: Lighting
standard by International Electrotechnical Commission, 12/07/2020

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IEC 62552-1 Amd.1 Ed. 1.0 b:2015

Amendment 1 – Household refrigerating appliances – Characteristics and test methods – Part 1: General requirements
Amendment by International Electrotechnical Commission, 11/30/2020

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IEC 60050-121 Amd.5 Ed. 2.0 b:2021

Amendment 5 – International Electrotechnical Vocabulary (IEV) – Part 121: Electromagnetism
Amendment by International Electrotechnical Commission, 03/29/2021

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IEC 60050-725 Amd.3 Ed. 2.0 b:2021

Amendment 3 – International Electrotechnical Vocabulary (IEV) – Part 725: Space radiocommunications
Amendment by International Electrotechnical Commission, 03/29/2021

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IEC 60675-2 Ed. 1.0 b:2020

Household electric direct-acting room heaters – Methods for measuring performance – Part 2: Additional provisions for the measurement of the radiant factor
standard by International Electrotechnical Commission, 12/04/2020

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IEC 61215-1-3 Ed. 2.0 b:2021

Terrestrial photovoltaic (PV) modules – Design qualification and type approval – Part 1-3: Special requirements for testing of thin-film amorphous silicon based photovoltaic (PV) modules
standard by International Electrotechnical Commission, 02/23/2021

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IEC 62325-451-10 Ed. 1.0 b:2020

Framework for energy market communications – Part 451-10: Profiles for Energy Consumption Data (¿¿¿My Energy Data¿¿¿)
standard by International Electrotechnical Commission, 11/27/2020

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IEC 61158-6-21 Ed. 2.0 b:2019

Industrial communication networks – Fieldbus specifications – Part 6-21: Application layer protocol specification – Type 21 elements
standard by International Electrotechnical Commission, 06/20/2019

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IEC 61189-5-601 Ed. 1.0 b:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
standard by International Electrotechnical Commission, 02/03/2021

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