Fibre optic active components and devices – Package and interface standards – Part 15: Discrete vertical cavity surface emitting laser packages
standard by International Electrotechnical Commission, 12/17/2009
Optical circuit boards – Basic test and measurement procedures – Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards
standard by International Electrotechnical Commission, 05/24/2017
Semiconductor devices – Hot carrier test on MOS transistors
standard by International Electrotechnical Commission, 04/26/2010
Fibre optic active components and devices – Package and interface standards – Part 7: SFF LC 10-pin transceivers
standard by International Electrotechnical Commission, 02/10/2003
Electricity metering – Payment systems – Part 51: Standard transfer specification (STS) – Physical layer protocol for one-way numeric and magnetic card token carriers
standard by International Electrotechnical Commission, 05/23/2007
Amendment 1 – Ultrasonics – Field characterization – Test methods for the determination of thermal and mechanical indices related to medical diagnostic ultrasonic fields
Amendment by International Electrotechnical Commission, 09/29/2017
Field device tool (FDT) interface specification – Part 306: Communication profile integration – IEC 61784 CPF 6
standard by International Electrotechnical Commission, 06/30/2009
Digital audio – Digital input-output interfacing – Transmission of digital audio over asynchronous transfer mode (ATM) networks
standard by International Electrotechnical Commission, 11/23/2004
High-voltage switchgear and controlgear – Part 207: Seismic qualification for gas-insulated switchgear assemblies for rated voltages above 52 kV
standard by International Electrotechnical Commission, 04/27/2012
Electric toys – Safety CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 11/02/2004
