IEC 60114 Ed. 1.0 b CORR1:1959

Corrigendum 1 – Recommendation for heat-treated aluminium alloy busbar material of the aluminium-magnesium-silicon type
Corrigenda by International Electrotechnical Commission, 01/01/1959

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IEC 60335-2-15 Amd.1 Ed. 6.0 b:2016

Amendment 1 – Household and similar electrical appliances – Safety – Part 2-15: Particular requirements for appliances for heating liquids
Amendment by International Electrotechnical Commission, 04/08/2016

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IEC 60076-10 Ed. 1.0 b:2005

Power transformers – Part 10: Determination of sound levels
standard by International Electrotechnical Commission, 07/21/2005

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IEC 60061-2 Amd.30 Ed. 3.0 b:2003

Amendment 30 – Lamp caps and holders together with gauges for the control of interchangeability and safety – Part 2 : Lampholders
Amendment by International Electrotechnical Commission, 10/30/2003

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IEC 60315-3 Ed. 2.0 b CORR1:1994

Corrigendum 1 – Methods of measurement on radio receivers for various classes of emission. Part 3: Receivers for amplitude-modulated sound-broadcasting emissions
standard by International Electrotechnical Commission, 03/01/1994

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IEC 60309-2 Amd.2 Ed. 4.0 b:2012

Amendment 2 – Plugs, socket-outlets and couplers for industrial purposes – Part 2: Dimensional interchangeability requirements for pin and contact-tube accessories
Amendment by International Electrotechnical Commission, 03/15/2012

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IEC 60335-2-16 Ed. 5.1 b:2008

Household and similar electrical appliances – Safety – Part 2-16: Particular requirements for food waste disposers CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 07/15/2008

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IEC 60317-2 Amd.2 Ed. 3.0 b:1999

Amendment 2 – Specifications for particular types of winding wires. Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer
Amendment by International Electrotechnical Commission, 10/20/1999

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IEC 60216-6 Ed. 2.0 b:2006

Electrical insulating materials – Thermal endurance properties – Part 6: Determination of thermal endurance indices (TI and RTE) of an insulating material using the fixed time frame method
standard by International Electrotechnical Commission, 05/29/2006

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IEC 60191-4 Amd.2 Ed. 2.0 b:2002

Amendment 2 – Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Amendment by International Electrotechnical Commission, 07/17/2002

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