IEC 60317-36 Amd.1 Ed. 2.0 b:2013

Amendment 1 – Specifications for particular types of winding wires – Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
Amendment by International Electrotechnical Commission, 06/12/2019

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IEC 60317-28 Ed. 1.0 b:1990

Specifications for particular types of winding wires. Part 28: Polyesterimide enamelled rectangular copper wire, class 180
standard by International Electrotechnical Commission, 10/15/1990

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IEC 60317-23 Ed. 3.0 b:2013

Specifications for particular types of winding wires – Part 23: Solderable polyesterimide enamelled round copper wire, class 180
standard by International Electrotechnical Commission, 10/10/2013

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IEC 60264-2-2 Amd.1 Ed. 1.0 b:2003

Amendment 1 – Packaging of winding wires – Part 2-2: Cylindrical barrelled delivery spools – Specification for returnable spools made from thermoplastic material
Amendment by International Electrotechnical Commission, 12/19/2003

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IEC 60169-12 Ed. 1.0 b:1979

Radio-frequency connectors – Part 12: R.F. coaxial connectors with screw coupling, unmatched (Type UHF)
standard by International Electrotechnical Commission, 01/01/1979

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IEC 60153-6 Ed. 1.0 b:1967

Hollow metallic waveguides – Part 6: Relevant specifications for medium flat rectangular waveguides
standard by International Electrotechnical Commission, 01/01/1967

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IEC 60115-8-1 Ed. 2.0 b:2014

Fixed resistors for use in electronic equipment – Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
standard by International Electrotechnical Commission, 10/17/2014

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IEC 60331-21 Ed. 1.0 b:1999

Tests for electric cables under fire conditions – Circuit integrity – Part 21: Procedures and requirements – Cables of rated voltage up to and including 0,6/1,0 kV
standard by International Electrotechnical Commission, 04/28/1999

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IEC 60264-4-2 Amd.1 Ed. 1.0 b:2003

Amendment 1 – Packaging of winding wires – Part 4-2: Methods of test – Containers made from thermoplastic material for taper barrelled delivery spools
Amendment by International Electrotechnical Commission, 12/11/2003

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IEC 60191-1 Ed. 3.0 en:2018

Mechanical standardization of semiconductor devices – Part 1: General rules for the preparation of outline drawings of discrete devices
standard by International Electrotechnical Commission, 01/23/2018

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