IEC 60793-1-48 Ed. 2.0 b:2007

Optical fibres – Part 1-48: Measurement methods and test procedures – Polarization mode dispersion
standard by International Electrotechnical Commission, 06/06/2007

  • by admin
  • Comments Off on IEC 60793-1-48 Ed. 2.0 b:2007
  • IEC

IEC 60747-7-3 Ed. 1.0 b:1991

Semiconductor devices – Discrete devices – Part 7: Bipolar transistors – Section three: Blank detail specification for bipolar transistors for switching applications
standard by International Electrotechnical Commission, 08/02/1991

  • by admin
  • Comments Off on IEC 60747-7-3 Ed. 1.0 b:1991
  • IEC

IEC 60747-16-3 Amd.1 Ed. 1.0 en:2009

Amendment 1 – Semiconductor devices – Part 16-3: Microwave integrated circuits – Frequency converters
Amendment by International Electrotechnical Commission, 03/10/2009

  • by admin
  • Comments Off on IEC 60747-16-3 Amd.1 Ed. 1.0 en:2009
  • IEC

IEC 60384-8 Ed. 3.0 b:2005

Fixed capacitors for use in electronic equipment – Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, Class 1
standard by International Electrotechnical Commission, 05/19/2005

  • by admin
  • Comments Off on IEC 60384-8 Ed. 3.0 b:2005
  • IEC

IEC 60745-2-20 Ed. 1.1 b:2008

Hand-held motor-operated electric tools – Safety – Part 2-20: Particular requirements for band saws CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 07/17/2008

  • by admin
  • Comments Off on IEC 60745-2-20 Ed. 1.1 b:2008
  • IEC

IEC 60335-2-73 Amd.1 Ed. 2.0 b:2006

Amendment 1 – Household and similar electrical appliances – Safety – Part 2-73: Particular requirements for fixed immersion heaters
Amendment by International Electrotechnical Commission, 01/23/2006

  • by admin
  • Comments Off on IEC 60335-2-73 Amd.1 Ed. 2.0 b:2006
  • IEC

IEC 60603-13 Ed. 1.0 b:1995

Connectors for frequencies below 3 MHz for use with printed boards – Part 13: Detail specification for two-part connectors of assessed quality, for printed boards for basic grid of 2,54 mm (0,1 in), with free connectors for non-accessible insulation displacement terminations (ID)
standard by International Electrotechnical Commission, 01/25/1995

  • by admin
  • Comments Off on IEC 60603-13 Ed. 1.0 b:1995
  • IEC

IEC 60749-3 Ed. 2.0 b:2017

Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
standard by International Electrotechnical Commission, 03/03/2017

  • by admin
  • Comments Off on IEC 60749-3 Ed. 2.0 b:2017
  • IEC

IEC 60749-19 Ed. 1.1 b:2010

Semiconductor devices – Mechanical and climatic test methods – Part 19: Die shear strength CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 11/29/2010

  • by admin
  • Comments Off on IEC 60749-19 Ed. 1.1 b:2010
  • IEC

IEC 60748-2-7 Ed. 1.0 b:1992

Semiconductor devices. Integrated circuits – Part 2: Digital integrated circuits – Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories
standard by International Electrotechnical Commission, 10/23/1992

  • by admin
  • Comments Off on IEC 60748-2-7 Ed. 1.0 b:1992
  • IEC