IEC 60642 Ed. 1.0 b:1979

Piezoelectric ceramic resonators and resonator units for frequency control and selection – Chapter I: Standard values and conditions – Chapter II: Measuring and test conditions
standard by International Electrotechnical Commission, 01/01/1979

IEC 60738-1 Ed. 3.1 en:2009

Thermistors – Directly heated positive temperature coefficient -Part 1: Generic specification CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 07/30/2009

IEC 60730-2-2 Amd.1 Ed. 2.0 b:2005

Amendment 1 – Automatic electrical controls for household and similar use – Part 2-2: Particular requirements for thermal motor protectors
Amendment by International Electrotechnical Commission, 07/20/2005

IEC 60454-3-7 Ed. 2.0 b:1998

Pressure-sensitive adhesive tapes for electrical purposes – Part 3: Specifications for individual materials – Sheet 7: Polyimide film tapes with pressure-sensitive adhesive
standard by International Electrotechnical Commission, 03/16/1998

IEC 60674-2 Ed. 2.0 en:2016

Specification for plastic films for electrical purposes – Part 2: Methods of test
standard by International Electrotechnical Commission, 11/18/2016

IEC 60669-1 Amd.2 Ed. 3.0 b:2006

Amendment 2 – Switches for household and similar fixed-electrical installations – Part 1: General requirements
Amendment by International Electrotechnical Commission, 10/11/2006

IEC 60619 Amd.1 Ed. 2.0 b:1995

Amendment 1 – Electrically operated food preparation appliances – Methods for measuring the performance
Amendment by International Electrotechnical Commission, 08/30/1995

IEC 60747-16-4 Ed. 1.1 b:2011

Semiconductor devices – Part 16-4: Microwave integrated circuits – Switches CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 04/21/2011

IEC 60747-14-3 Ed. 1.0 en:2001

Semiconductor devices – Part 14-3: Semiconductor sensors – Pressure sensors
standard by International Electrotechnical Commission, 06/27/2001

IEC 60747-1 Amd.1 Ed. 2.0 b:2010

Amendment 1 – Semiconductor devices – Part 1: General
Amendment by International Electrotechnical Commission, 05/19/2010