IEC 60713 Ed. 1.0 b:1981
Subroutines for CAMAC
standard by International Electrotechnical Commission, 01/01/1981
- Comments Off on IEC 60713 Ed. 1.0 b:1981
- IEC
Subroutines for CAMAC
standard by International Electrotechnical Commission, 01/01/1981
Pressure-sensitive adhesive tapes for electrical purposes – Part 3: Specifications for individual materials – Sheet 19: Tapes made from various backing materials with pressure-sensitive adhesive on both sides
standard by International Electrotechnical Commission, 05/19/2003
Fixed capacitors for use in electronic equipment – Part 24-1: Blank detail specification – Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolyte – Assessment level EZ
standard by International Electrotechnical Commission, 06/26/2006
Amendment 1 – Semiconductor devices – Discrete devices – Part 4: Microwave diodes and transistors
Amendment by International Electrotechnical Commission, 01/30/2017
Method of measurement of resistivity of metallic materials
standard by International Electrotechnical Commission, 01/01/1974
Fixed capacitors for use in electronic equipment. Part 12: Blank detail specification: Fixed polycarbonate film dielectric metal foil d.c. capacitors. Assessment level E
standard by International Electrotechnical Commission, 07/15/1988
Semiconductor devices – Part 16-4: Microwave integrated circuits – Switches CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 04/21/2011
Amendment 1 – Specification for pressboard and presspaper for electrical purposes. Part 1: Definitions and general requirements
Amendment by International Electrotechnical Commission, 06/11/1993
Corrigendum 1 – Classification of environmental conditions. Part 3: Classification of groups of environmental parameters and their severities. Introduction
Corrigenda by International Electrotechnical Commission, 12/01/1985
Electrical insulating materials – Determination of electrolytic corrosion caused by insulating materials – Test methods
standard by International Electrotechnical Commission, 01/29/2007