IEC 60749-9 Ed. 2.0 en:2017

Semiconductor devices – Mechanical and climatic test methods – Part 9: Permanence of marking
standard by International Electrotechnical Commission, 03/03/2017

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IEC 60605-3-1 Ed. 1.0 b:1986

Equipment reliability testing. Part 3: Preferred test conditions. Indoor portable equipment – Low degree of simulation
standard by International Electrotechnical Commission, 09/30/1986

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IEC 60558 Amd.1 Ed. 1.0 b:1987

Amendment 1 – Type C helical video tape recorders
Amendment by International Electrotechnical Commission, 01/01/1987

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IEC 60519-11 Ed. 2.0 b:2007

Safety in electroheat installations – Part 11: Particular requirements for installations using the effect of electromagnetic forces on liquid metals
standard by International Electrotechnical Commission, 06/22/2007

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IEC 60747-14-10 Ed. 1.0 b:2019

Semiconductor devices – Part 14-10: Semiconductor sensors – Performance evaluation methods for wearable glucose sensors
standard by International Electrotechnical Commission, 11/13/2019

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IEC 60746-4 Ed. 2.0 b:2018

Expression of performance of electrochemical analyzers – Part 4: Dissolved oxygen in water measured by membrane-covered amperometric sensors
standard by International Electrotechnical Commission, 12/13/2018

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IEC 60519-6 Ed. 3.0 b:2011

Safety in electroheat installations – Part 6: Specifications for safety in industrial microwave heating equipment
standard by International Electrotechnical Commission, 01/27/2011

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IEC 60519-11 Ed. 1.0 b:1997

Safety in electroheat installations – Part 11: Particular requirements for installations for electromagnetic stirring, transport or pouring of metal liquids
standard by International Electrotechnical Commission, 05/09/1997

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IEC 60793-1-30 Ed. 2.0 en:2010

Optical fibres – Part 1-30: Measurement methods and test procedures – Fibre proof test
standard by International Electrotechnical Commission, 05/19/2010

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IEC 60730-2-14 Ed. 2.1 b:2019

Automatic electrical controls – Part 2-14: Particular requirements for electric actuators CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 03/22/2019

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