IEC 60684-3-214 Ed. 4.0 b:2019

Flexible insulating sleeving – Part 3: Specifications for individual types of sleeving – Sheet 214: Heat-shrinkable, polyolefin sleeving, not flame retarded, thick and medium wall
standard by International Electrotechnical Commission, 08/08/2019

IEC 60605-6 Ed. 2.0 b:1997

Equipment reliability testing – Part 6: Tests for the validity of the constant failure rate or constant failure intensity assumptions
standard by International Electrotechnical Commission, 04/23/1997

IEC 60749-3 Ed. 1.0 b:2002

Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual inspection
standard by International Electrotechnical Commission, 04/09/2002

IEC 60747-4 Amd.1 Ed. 1.0 b:1993

Amendment 1 – Semiconductor devices – Discrete devices – Part 4: Microwave diodes and transistors
Amendment by International Electrotechnical Commission, 10/08/1993

IEC 60679-1 Amd.1 Ed. 2.0 b:2002

Amendment 1 – Quartz crystal controlled oscillators of assessed quality – Part 1: Generic specification
Amendment by International Electrotechnical Commission, 01/15/2002

IEC 60601-1-11 Ed. 2.0 b:2015

Medical electrical equipment – Part 1-11: General requirements for basic safety and essential performance – Collateral Standard: Requirements for medical electrical equipment and medical electrical systems used in the home healthcare environment
standard by International Electrotechnical Commission, 01/20/2015

IEC 60721-2-1 Ed. 2.0 b:2013

Classification of environmental conditions – Part 2-1: Environmental conditions appearing in nature – Temperature and humidity
standard by International Electrotechnical Commission, 06/25/2013

IEC 60684-3-214 Ed. 1.0 b:2001

Flexible insulating sleeving – Part 3: Specifications for individual types of sleeving – Sheet 214: Heat-shrinkable, polyolefin sleeving, not flame retarded, shrink ratio 3:1 – Thick and medium wall
standard by International Electrotechnical Commission, 03/28/2001

IEC 60678 Ed. 1.0 b:1980

Definitions of CAMAC terms used in IEC publications
standard by International Electrotechnical Commission, 01/01/1980

IEC 60749-11 Ed. 1.0 b CORR1:2003

Corrigendum 1 – Semiconductor devices – Mechanical and climatic test methods – Part 11: Rapid change of temperature – Two-fluid-bath method
Corrigenda by International Electrotechnical Commission, 01/30/2003