Flexible insulating sleeving – Part 3: Specifications for individualtypes of sleeving – Sheet 280: Heat-shrinkable, polyolefin sleeving,anti-tracking CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 12/12/2013
Semiconductor devices – Integrated circuits – Part 4: Interface integrated circuits – Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)
standard by International Electrotechnical Commission, 11/11/1993
Hand-held motor-operated electric tools – Safety – Part 2-21: Particular requirements for drain cleaners CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 08/13/2008
Synthetic quartz crystal – Specifications and guidelines for use
standard by International Electrotechnical Commission, 05/18/2016
Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
standard by International Electrotechnical Commission, 01/30/2008
Amendment 1 – Semiconductor devices – Discrete devices – Part 5-5: Optoelectronic devices – Photocouplers
Amendment by International Electrotechnical Commission, 05/13/2013
Classification of environmental conditions – Part 2: Environmental conditions appearing in nature. Air pressure
standard by International Electrotechnical Commission, 12/30/1987
Optical fibres – Part 1-32: Measurement methods and test procedures – Coating strippability
standard by International Electrotechnical Commission, 07/31/2001
Laminated pressboard for electrical purposes – Part 1: Definitions, classification and general requirements
standard by International Electrotechnical Commission, 08/06/2010
Electrical penetration assemblies in containment structures for nuclear power generating stations
standard by International Electrotechnical Commission, 01/01/1983
