IEC 60749-29 Ed. 2.0 b:2011
Semiconductor devices – Mechanical and climatic test methods – Part 29: Latch-up test
standard by International Electrotechnical Commission, 04/07/2011
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Semiconductor devices – Mechanical and climatic test methods – Part 29: Latch-up test
standard by International Electrotechnical Commission, 04/07/2011
Thermistors – Directly heated positive temperature coefficient – Part 1: Generic specification
standard by International Electrotechnical Commission, 04/10/2006
Optical fibres – Part 2-40: Product specifications – Sectional specification for category A4 multimode fibres
standard by International Electrotechnical Commission, 03/20/2006
Amendment 1 – Hand-held motor-operated electric tools – Safety – Part 2-19: Particular requirements for jointers
Amendment by International Electrotechnical Commission, 05/26/2010
Amendment 1 – Semiconductor devices – Mechanical and climatic test methods – Part 27: Electrostatic discharge (ESD) sensitivity testing – Machine model (MM)
Amendment by International Electrotechnical Commission, 09/25/2012
Optical fibre cables – Part 2-11: Indoor optical fibre cables – Detailed specification for simplex and duplex cables for use in premises cabling
standard by International Electrotechnical Commission, 04/12/2019
Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type VHS – Part 2: FM audio recording
standard by International Electrotechnical Commission, 11/25/1999
Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits – Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
standard by International Electrotechnical Commission, 12/21/1994
Semiconductor devices – Part 16-5: Microwave integrated circuits – Oscillators
standard by International Electrotechnical Commission, 06/19/2013
Amendment 1 – Hand-held motor-operated electric tools – Safety – Part 2-20: Particular requirements for band saws
Amendment by International Electrotechnical Commission, 05/27/2008