IEC 60747-1 Ed. 2.1 b:2010

Semiconductor devices – Part 1: General CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 08/23/2010

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IEC 60794-3 Ed. 4.0 b:2014

Optical fibre cables – Part 3: Outdoor cables – Sectional specification
standard by International Electrotechnical Commission, 09/09/2014

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IEC 60793-1-54 Ed. 2.0 b:2012

Optical fibres – Part 1-54: Measurement methods and test procedures – Gamma irradiation
standard by International Electrotechnical Commission, 10/25/2012

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IEC 60749-22 Ed. 1.0 b CORR1:2003

Corrigendum 1 – Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength
Corrigenda by International Electrotechnical Commission, 08/13/2003

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IEC 60747-16-4 Amd.1 Ed. 1.0 en:2009

Amendment 1 – Semiconductor devices – Part 16-4: Microwave integrated circuits – Switches
Amendment by International Electrotechnical Commission, 03/10/2009

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IEC 60749-8 Ed. 1.0 b CORR2:2003

Corrigendum 2 – Semiconductor devices – Mechanical and climatic test methods – Part 8: Sealing
Corrigenda by International Electrotechnical Commission, 08/12/2003

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IEC 60749-32 Amd.1 Ed. 1.0 b:2010

Amendment 1 – Semiconductor devices – Mechanical and climatic test methods – Part 32: Flammability of plastic-encapsulated devices (externally induced)
Amendment by International Electrotechnical Commission, 07/28/2010

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IEC 60767 Ed. 1.0 b:1983

Helical-scan video-tape cassette system using 12.65 mm (0.5 in) magnetic tape on type beta-format
standard by International Electrotechnical Commission, 01/01/1983

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IEC 60794-2-31 Ed. 3.0 b:2019

Optical fibre cables – Part 2-31: Indoor cables – Detailed specification for optical fibre ribbon cables for use in premises cabling
standard by International Electrotechnical Commission, 04/12/2019

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