Laminated pressboard for electrical purposes – Part 3: Specifications for individual materials – Sheet 1: Requirements for laminated precompressed pressboard, Types LB3.1A.1 and LB3.1A.2
standard by International Electrotechnical Commission, 08/06/2010
Semiconductor devices – Part 16-3: Microwave integrated circuits – Frequency converters
standard by International Electrotechnical Commission, 05/07/2002
Optical fibre cables – Part 2-31: Indoor cables – Detailed specification for optical fibre ribbon cables for use in premises cabling
standard by International Electrotechnical Commission, 06/10/2005
Semiconductor devices – Discrete devices – Part 7: Bipolar transistors
standard by International Electrotechnical Commission, 09/23/2019
Optical fibre cables – Part 2-30: Indoor cables – Family specification for ribbon cables
standard by International Electrotechnical Commission, 10/08/2008
Amendment 1 – Test on gases evolved during combustion of materials from cables – Part 2: Determination of acidity (by pH measurement) and conductivity
Amendment by International Electrotechnical Commission, 11/25/2019
Optical fibres – Part 1-20: Measurement methods and test procedures – Fibre geometry
standard by International Electrotechnical Commission, 09/17/2001
Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 08/10/2011
Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type VHS – Part 3: S-VHS
standard by International Electrotechnical Commission, 10/15/1993
Semiconductor devices – Mechanical and climatic test methods – Part 33: Accelerated moisture resistance – Unbiased autoclave
standard by International Electrotechnical Commission, 03/09/2004
