Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies
standard by International Electrotechnical Commission, 08/28/1998
Printed boards and printed board assemblies – Design and use – Part 1-1: Generic requirements – Flatness considerations for electronic assemblies
standard by International Electrotechnical Commission, 08/26/1997
Industrial communication networks – Fieldbus specifications – Part 6-7: Application layer protocol specification – Type 7 elements
standard by International Electrotechnical Commission, 12/14/2007
Optical fibre amplifiers – Basic specification – Part 1-2: Test methods for gain parameters – Electrical spectrum analyzer
standard by International Electrotechnical Commission, 06/19/1998
Designations for signals and connections
standard by International Electrotechnical Commission, 07/14/1993
Multicore and symmetrical pair/quad cables for digital communications – Part 11: Symmetrical single pair cables with transmission characteristics up to 600 MHz – Horizontal floor wiring – Sectional specification
standard by International Electrotechnical Commission, 05/06/2019
Industrial communication networks – Fieldbus specifications – Part 4-11: Data-link layer protocol specificationn – Type 11 elements
standard by International Electrotechnical Commission, 08/15/2014
Ultrasonics – Power measurement – Radiation force balances and performance requirements
standard by International Electrotechnical Commission, 12/13/2006
Insulating materials – Industrial rigid round laminated tubes and rods based on thermosetting resins for electrical purposes – Part 1: Definitions, designations and general requirements
standard by International Electrotechnical Commission, 03/08/2006
Digital data communications for measurement and control – Fieldbus for use in industrial control systems – Part 3: Data link service definition
standard by International Electrotechnical Commission, 05/27/2003
