IEC 61158-4 Ed. 3.0 en:2003

Digital data communications for measurement and control – Fieldbus for use in industrial control systems – Part 4: Data link protocol specification
standard by International Electrotechnical Commission, 05/27/2003

IEC 61191-6 Ed. 1.0 b:2010

Printed board assemblies – Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
standard by International Electrotechnical Commission, 01/14/2010

IEC 61158-6-26 Ed. 1.0 en:2019

Industrial communication networks – Fieldbus specifications – Part 6-26: Application layer protocol specification – Type 26 elements
standard by International Electrotechnical Commission, 06/20/2019

IEC 61300-2-48 Ed. 1.0 b:2004

Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-48: Tests – Temperature-humidity cycling
standard by International Electrotechnical Commission, 12/14/2004

IEC 61158-5-19 Ed. 2.0 b:2010

Industrial communication networks – Fieldbus specifications – Part 5-19: Application layer service definition – Type 19 elements
standard by International Electrotechnical Commission, 08/06/2010

IEC 61267 Ed. 2.0 b:2005

Medical diagnostic X-ray equipment – Radiation conditions for use in the determination of characteristics
standard by International Electrotechnical Commission, 11/09/2005

IEC 61190-1-2 Ed. 3.0 b:2014

Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
standard by International Electrotechnical Commission, 02/19/2014

IEC 61189-3-719 Ed. 1.0 b:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3-719: Test methods for interconnection structures (printed boards) – Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
standard by International Electrotechnical Commission, 01/05/2016

IEC 61300-2-47 Ed. 4.0 b:2016

Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-47: Tests – Thermal shocks
standard by International Electrotechnical Commission, 05/19/2016

IEC 61249-2-47 Ed. 1.0 en:2018

Materials for printed boards and other interconnecting structures – Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m¿¿¿K) and defined flammability (vertical burning test), copper-clad fo
standard by International Electrotechnical Commission, 01/10/2018