Workmanship requirements for soldered electronic assemblies – Part 5: Rework, modification and repair of soldered electronic assemblies
standard by International Electrotechnical Commission, 05/23/2007
Evaluation and routine testing in medical imaging departments – Part 2-5: Constancy tests – Image display devices
standard by International Electrotechnical Commission, 03/30/1994
Industrial communication networks – Fieldbus specifications – Part 6-17: Application layer protocol specification – Type 17 elements
standard by International Electrotechnical Commission, 12/14/2007
Maritime navigation and radiocommunication equipment and systems -Digital interfaces – Part 3: Serial data instrument network CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 07/21/2014
Amendment 1 – Live working – Voltage detectors – Part 1: Capacitive type to be used for voltages exceeding 1 kV a.c.
Amendment by International Electrotechnical Commission, 04/29/2009
Analogue audio recording on video tape – Polarity of magnetization
standard by International Electrotechnical Commission, 11/30/1993
Corrigendum 1 – Electrical installation guide – Part 53: Selection and erection of electrical equipment – Switchgear and controlgear
standard by International Electrotechnical Commission, 10/01/1995
Industrial communication networks – Fieldbus specifications – Part 3-21: Data-link layer service definition – Type 21 elements
standard by International Electrotechnical Commission, 08/05/2010
Digital data communications for measurement and control – Fieldbus for use in industrial control systems – Part 4: Data link protocol specification
standard by International Electrotechnical Commission, 05/27/2003
Printed board assemblies – Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
standard by International Electrotechnical Commission, 01/14/2010
