Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
standard by International Electrotechnical Commission, 02/19/2014
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3-719: Test methods for interconnection structures (printed boards) – Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
standard by International Electrotechnical Commission, 01/05/2016
Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-47: Tests – Thermal shocks
standard by International Electrotechnical Commission, 05/19/2016
Materials for printed boards and other interconnecting structures – Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m¿¿¿K) and defined flammability (vertical burning test), copper-clad fo
standard by International Electrotechnical Commission, 01/10/2018
Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-15: Tests – Torque strength of coupling mechanism
standard by International Electrotechnical Commission, 02/07/2008
Nuclear power plants – Control rooms – Operator controls
standard by International Electrotechnical Commission, 06/09/1993
Industrial communication networks – Fieldbus specifications – Part 5-5: Application layer service definition – Type 5 elements
standard by International Electrotechnical Commission, 12/14/2007
Industrial communication networks – Fieldbus specifications – Part 3-24: Data-link layer service definition – Type 24 elements
standard by International Electrotechnical Commission, 08/13/2014
Multicore and symmetrical pair/quad cables for digital communications – Part 10: Cables for cords with transmission characteristics up to 2 GHz – Sectional specification
standard by International Electrotechnical Commission, 04/20/2016
Process measurement and control devices – General methods and procedures for evaluating performance – Part 3: Tests for the effects of influence quantities
standard by International Electrotechnical Commission, 10/08/2008
