IPC TP-1115

Selection and Implementation Strategy for a Low-Residue, No-Clean Process
standard by Association Connecting Electronics Industries, 12/01/1998

IPC 9592A

Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
standard by Association Connecting Electronics Industries, 05/01/2010

IPC 2581

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
standard by Association Connecting Electronics Industries, 05/01/2012

IPC J-STD-030

Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
standard by Association Connecting Electronics Industries, 09/01/2005

IPC TR-551

Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components
standard by Association Connecting Electronics Industries, 07/01/1993

IPC TR-484

Results of IPC Copper Foil Ductility Round Robin Study
standard by Association Connecting Electronics Industries, 04/01/1986

IPC MI-660

Guidelines for Incoming Inspection of Printed Board Material
standard by Association Connecting Electronics Industries,

IPC TR-483

Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs – Includes addenda I and II
standard by Association Connecting Electronics Industries, 03/01/1991

IPC SC-60A

Post Solder Solvent Cleaning Handbook
standard by Association Connecting Electronics Industries, 08/01/1999

IPC J-STD-002C

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November 2008)
standard by Association Connecting Electronics Industries, 12/01/2007