IPC 2611

Generic Requirements for Electronic Product Documentation
standard by Association Connecting Electronics Industries, 04/01/2010

IPC 4103A

Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 12/01/2011

IPC 4411

Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement
standard by Association Connecting Electronics Industries, 04/01/1999

IPC 7094

Design and Assembly Process Implementation for Flip Chip and Die Size Components
standard by Association Connecting Electronics Industries, 02/01/2009

IPC D-325A

Documentation Requirements for Printed Boards
standard by Association Connecting Electronics Industries, 05/01/1995

IPC 4203

Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
standard by Association Connecting Electronics Industries, 05/01/2002

IPC 2516A

Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description
standard by Association Connecting Electronics Industries, 11/01/2000

IPC 7912A

End-Item DPMO for Printed
standard by Association Connecting Electronics Industries, 01/01/2004

IPC 9203

Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
standard by Association Connecting Electronics Industries, 05/01/2012

IPC T-50G

Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 12/01/2003