IPC 6012D-AM1
Amendment 1 to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 09/01/2017
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- IPC
Amendment 1 to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 09/01/2017
Printed Circuit Assembly Strain Gage Test Guideline
standard by Association Connecting Electronics Industries, 02/01/2012
IPC 6th Annual National Conference on Flexible Circuits: A Technology Comes of Age
standard by Association Connecting Electronics Industries, 06/01/2000
Technology Assessment Handbook on Multilayer Boards
standard by Association Connecting Electronics Industries,
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 10/31/2017
2000 Analysis for Rigid Printed Wiring Boards and Related Materials
Report / Survey by Association Connecting Electronics Industries, 01/01/2000