IPC 4103A-WAM1

Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2014

IPC 7711/7721C

Rework, Modification and Repair of Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2017

IPC 9201A

Surface Insulation Resistance Handbook
standard by Association Connecting Electronics Industries, 09/01/2007

IPC J-STD-032

Performance Standard for Ball Grid Array Balls (IPC/EIA J-STD-032)
standard by Association Connecting Electronics Industries, 06/01/2002

IPC 9708

Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010

IPC 7621

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
standard by Association Connecting Electronics Industries, 01/01/2018

IPC A-610F

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014

IPC D-859

Design Standard for Thick Film Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 12/01/1989

IPC 9691B

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
standard by Association Connecting Electronics Industries, 06/01/2016

IPC SA-61A

Post Solder Semiaqueous Cleaning Handbook
standard by Association Connecting Electronics Industries, 07/01/2002