IPC 6012DS

Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 2015

IPC TR-486

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
standard by Association Connecting Electronics Industries, 07/01/2001

IPC D-859

Design Standard for Thick Film Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 12/01/1989

IPC 9691B

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
standard by Association Connecting Electronics Industries, 06/01/2016

IPC SA-61A

Post Solder Semiaqueous Cleaning Handbook
standard by Association Connecting Electronics Industries, 07/01/2002

IPC TMRC-00T

2000 Technology Trends for Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 01/01/2000

IPC HDBK-4691

Handbook on Adhesive Bonding in Electronic Assembly Operations
standard by Association Connecting Electronics Industries, 11/01/2015

IPC QE-605A

Printed Board Quality Evaluation Handbook
standard by Association Connecting Electronics Industries, 02/01/1999

IPC 9199

Statistical Process Control (SPC) Quality Rating
standard by Association Connecting Electronics Industries, 09/01/2002

IPC 6013C

Qualification and Performance Specification for Flexible Printed Boards
standard by Association Connecting Electronics Industries,