IPC 9706

Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
standard by Association Connecting Electronics Industries, 12/01/2013

IPC D-326A

Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2004

IPC APEX-EXPO19

IPC APEX 2019 Technical Conference Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 04/11/2019

IPC 2226A

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017

IPC 2225

Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998

IPC 6018B

Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 11/01/2011

IPC J-STD-006B

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
standard by Association Connecting Electronics Industries, 01/01/2006

IPC 4811

Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2008

IPC 9111

Troubleshooting for Printed Board Assembly Processes
standard by Association Connecting Electronics Industries, 01/01/2019

IPC J-STD-001G – Amendment

Requirements for Soldered Electrical and Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 10/01/2018

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