IPC A-600K

Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 07/09/2020

IPC L-108B

Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 06/01/1990

IPC 9706

Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
standard by Association Connecting Electronics Industries, 12/01/2013

IPC D-326A

Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2004

IPC APEX-EXPO19

IPC APEX 2019 Technical Conference Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 04/11/2019

IPC 2226A

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017

IPC 2225

Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998

IPC J-STD-001G – Amendment

Requirements for Soldered Electrical and Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 10/01/2018

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  • Comments Off on IPC J-STD-001G – Amendment
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IPC M-103

Standards for Surface Mount Assemblies Manual
standard by Association Connecting Electronics Industries,

IPC DW-424

General Specification for Encapsulated Discrete Wire Interconnection Boards
standard by Association Connecting Electronics Industries, 01/01/1995