IPC A-38

Fine Line Round Robin Test Pattern
standard by Association Connecting Electronics Industries, 09/01/1984

IPC 7530

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
standard by Association Connecting Electronics Industries, 06/01/2001

IPC 9502

PWB Assembly Soldering Process Guideline for Electronic Components
standard by Association Connecting Electronics Industries, 04/01/1999

IPC 2223E

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 01/24/2020

IPC WP-1081

White Paper on Conflict Minerals Due Diligence Guidance
standard by Association Connecting Electronics Industries, 07/01/2015

IPC J-STD-020B

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 07/01/2002

IPC 7351

Generic Requirements for Surface Mount Land Pattern and Design Standard – INCLUDES LAND PATTERN VIEWER SOFTWARE
standard by Association Connecting Electronics Industries,

IPC J-STD-020A

Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
standard by Association Connecting Electronics Industries, 04/01/1999

IPC 9631

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010

IPC 6013D

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017