IPC J-STD-001FS WAM1

Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 2017

IPC 2581B-WAM1

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
standard by Association Connecting Electronics Industries, 12/01/2016

IPC TR-465-3

Evaluation of Steam Aging on Alternative Finishes, Phase 11A
standard by Association Connecting Electronics Industries, 07/01/1996

IPC 2221B

Generic Standard on Printed Board Design
standard by Association Connecting Electronics Industries, 11/01/2012

IPC D-350D

Printed Board Description in Digital Form
standard by Association Connecting Electronics Industries, 07/01/1992

IPC TF-870

Qualifications and Performance of Polymer Thick Film Printed Boards
standard by Association Connecting Electronics Industries, 01/01/1987

IPC J-STD-001C

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 03/01/2000

IPC J-STD-020E

Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
standard by Association Connecting Electronics Industries, 01/01/2015

IPC J-STD-020D-1

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 03/01/2008

IPC 4202A

Flexible Base Dielectrics for Use in Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 04/01/2010