IPC TR-485

Results of Copper Foil Rupture Strength Test Round Robin Study
standard by Association Connecting Electronics Industries, 03/01/1985

IPC T-50M

Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 05/01/2015

IPC 6018CS

Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Amendment by Association Connecting Electronics Industries, 07/01/2016

IPC 6012D

Qualification and Performance Specification for Rigid Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2015

IPC 4591

Requirements for Printed Electronics Functional Conductive Materials
standard by Association Connecting Electronics Industries, 11/01/2012

IPC 6016

Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
standard by Association Connecting Electronics Industries, 05/01/1999

IPC J-STD-004

Requirements for Soldering Fluxes
standard by Association Connecting Electronics Industries,

IPC TR-580

Cleaning and Cleanliness Test Program Phase 1 Test Results
standard by Association Connecting Electronics Industries, 10/01/1989

IPC J-STD-027

Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
standard by Association Connecting Electronics Industries, 02/01/2003

IPC TA-723

Technology Assessment Handbook on Surface Mounting
standard by Association Connecting Electronics Industries,