JEDEC J-STD-033D
Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
standard by JEDEC Solid State Technology Association, 04/01/2018
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Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
standard by JEDEC Solid State Technology Association, 04/01/2018
SEMICONDUCTOR POWER CONTROL MODULES
standard by JEDEC Solid State Technology Association, 11/01/1986
GDDR5 SGRAM
standard by JEDEC Solid State Technology Association, 09/01/2009
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
standard by JEDEC Solid State Technology Association, 03/01/2018
POD135 – 1.35 V Pseudo Open Drain I/O
standard by JEDEC Solid State Technology Association, 06/01/2019
MECHANICAL COMPRESSIVE STATIC STRESS TEST METHODS
standard by JEDEC Solid State Technology Association, 10/01/2018
PROCEDURE FOR THE EVQLUQTION OF LOW-k/METAL INTER/INTRA-LEVEL DIELECTRIC INTEGRITY
standard by JEDEC Solid State Technology Association, 08/01/2010
MULTIMEDIACARD (MMC) MECHANICAL STANDARD
standard by JEDEC Solid State Technology Association, 12/01/2007
ACCELERATED MOISTURE RESISTANCE – UNBIASED HAST
standard by JEDEC Solid State Technology Association, 03/01/2011
CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
standard by JEDEC Solid State Technology Association, 03/01/2009