JEDEC JEP156
CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
standard by JEDEC Solid State Technology Association, 03/01/2009
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CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
standard by JEDEC Solid State Technology Association, 03/01/2009
INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH
standard by JEDEC Solid State Technology Association, 11/01/2010
CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES
standard by JEDEC Solid State Technology Association, 03/01/2014
Embedded Multi-media card (e*MMC), Electrical Standard (5.1)
standard by JEDEC Solid State Technology Association, 02/01/2015
Descriptive Designation System for Semiconductor-device Packages
standard by JEDEC Solid State Technology Association, 01/01/2016
POD12-1.2 V Pseudo Open Drain Interface
standard by JEDEC Solid State Technology Association, 08/01/2011
REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES
standard by JEDEC Solid State Technology Association, 01/01/2012
SUBASSEMBLY MECHANICAL SHOCK
standard by JEDEC Solid State Technology Association, 11/01/2004
Addendum No. 1 to JESD79-3 – 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
Amendment by JEDEC Solid State Technology Association, 01/01/2013
Byte Addressable Energy Backed Interface
standard by JEDEC Solid State Technology Association, 07/01/2017