JEDEC JESD79-4-1
Addendum No. 1 to JESD79-4, 3D Stacked DRAM Standard
Amendment by JEDEC Solid State Technology Association, 02/01/2017
- Comments Off on JEDEC JESD79-4-1
- JEDEC
Addendum No. 1 to JESD79-4, 3D Stacked DRAM Standard
Amendment by JEDEC Solid State Technology Association, 02/01/2017
Component Quality Problem Analysis and Corrective Action Requirements (Including Administrative Quality Problems)
standard by JEDEC Solid State Technology Association, 06/01/2012
RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES
standard by JEDEC Solid State Technology Association, 04/01/2008
TEMPERATURE, BIAS, AND OPERATING LIFE
standard by JEDEC Solid State Technology Association, 07/01/2017
CYCLED TEMPERATURE HUMIDITY BIAS LIFE TEST
standard by JEDEC Solid State Technology Association, 07/01/2013
IC LATCH-UP TEST
standard by JEDEC Solid State Technology Association, 11/01/2011
STANDARD FOR DESCRIPTION OF 3.3 V NFET BUS SWITCH DEVICES WITH INTEGRATED CHARGE PUMPS
standard by JEDEC Solid State Technology Association, 08/01/2001
STANDARD DESCRIPTION OF 1.5 V CMOS LOGIC DEVICES
standard by JEDEC Solid State Technology Association, 08/01/2001
SYMBOL AND LABEL FOR ELECTROSTATIC SENSITIVE DEVICES
standard by JEDEC Solid State Technology Association,
DDR4 DATA BUFFER DEFINITION (DDR4DB01)
standard by JEDEC Solid State Technology Association,