JEDEC JEP136

SIGNATURE ANALYSIS
standard by JEDEC Solid State Technology Association, 07/01/1999

JEDEC JEP150

STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS
standard by JEDEC Solid State Technology Association, 05/01/2005

JEDEC JESD8-21A

POD135 – 1.35 V PSEUDO OPEN DRAIN I/O
standard by JEDEC Solid State Technology Association, 09/01/2013

JEDEC JESD49A.01

PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD)
standard by JEDEC Solid State Technology Association, 10/01/2013

JEDEC JESD201A

ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHED
standard by JEDEC Solid State Technology Association, 08/01/2008

JEDEC JESD67

I/O DRIVERS AND RECEIVERS WITH CONFIGURABLE COMMUNICATION VOLTAGE, IMPEDANCE, AND RECEIVER THRESHOLD
standard by JEDEC Solid State Technology Association, 02/01/1999

JEDEC JEP172A

DISCONTINUING USE OF THE MACHINE MODEL FOR DEVICE ESD QUALIFICATION
standard by JEDEC Solid State Technology Association, 07/01/2015

JEDEC JESD51-2A

INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS – NATURAL CONVECTION (STILL AIR)
standard by JEDEC Solid State Technology Association, 01/01/2007

JEDEC JESD51-32

THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES
standard by JEDEC Solid State Technology Association, 12/01/2010