IEC 60749-19 Ed. 1.0 b:2003
- Comments Off on IEC 60749-19 Ed. 1.0 b:2003
- IEC
Click here to purchase
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
Product Details
- Edition:
- 1.0
- Published:
- 02/13/2003
- Number of Pages:
- 11
- File Size:
- 1 file , 200 KB
