
IEC 60749-20 Ed. 1.0 b:2002
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Applies to semiconductor devices (discrete devices and integrated circuits) – and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.
Product Details
- Edition:
- 1.0
- Published:
- 09/30/2002
- Number of Pages:
- 49
- File Size:
- 1 file , 1.7 MB