IEC 60749-20 Ed. 1.0 b:2002

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Applies to semiconductor devices (discrete devices and integrated circuits) – and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

Product Details

Edition:
1.0
Published:
09/30/2002
Number of Pages:
49
File Size:
1 file , 1.7 MB