IEC 60749-23 Ed. 1.0 b:2004
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This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.
Product Details
- Edition:
- 1.0
- Published:
- 02/23/2004
- Number of Pages:
- 17
- File Size:
- 1 file , 500 KB
