IEC 60749-3 Ed. 1.0 b:2002
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- IEC
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Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.
Product Details
- Edition:
- 1.0
- Published:
- 04/09/2002
- Number of Pages:
- 7
- File Size:
- 1 file , 360 KB
