IEC 61188-1-2 Ed. 1.0 b:1998

• by admin
• Comments Off on IEC 61188-1-2 Ed. 1.0 b:1998
• IEC

Click here to purchase
The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

Product Details

Edition:

1.0

Published:

04/29/1998

Number of Pages:

83

File Size:

1 file , 470 KB