IEC 61188-5-2 Ed. 1.0 b:2003
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- IEC
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Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
Product Details
- Edition:
- 1.0
- Published:
- 06/24/2003
- Number of Pages:
- 103
- File Size:
- 1 file , 1.3 MB
